One of the most hotly patented and contested areas of sensor patent space is how stacked substrates talk to each other. Before Canon released its first stacked sensor in the R3, I had lost count of how many stacked sensor patents dealt with the interconnects between 2 substrates.
Canon News uncovered another in-depth patent for a stacked CMOS sensor. This is an area that Canon has been spending considerable R&D resources on over Read more...
Canon has released a couple of stacked sensor patent applications this week dealing with various issues surrounding the manufacturing or use of stacked sensors. In Read more...
Canon continues to put R&D into stacked sensors. This latest patent for the technology is quite detailed in its delivery. According to Canon News: This patent application is for suppressing the dark current and/or leakage current by using diffusion preventing films surrounding the bonding areas.
Canon continues to roll out the image sensor technology patents, as we get to see some new stacked and curved sensor patents. Canon News interprets all of these patents below. Japan Patent Application 2018-019270: We have found another patent application dealing with some of the problems and issues with curved sensors from Canon. Unlike some other Read more...
It’s patent day, and we have another stacked sensor patent. What’s interesting about this one is how detailed it is. It’s likely we’re going to see some stacked sensor technology in a Canon product sooner than later.
Canon continues to apply for patents for stacked sensors. With the number that we’ve seen over the last few months, I think it’s safe to say something is coming in the not-so-distant-future.